EMC Optimisation
Reduced radiated emissions by more than 50% using laboratory-based VNA troubleshooting and measurement techniques.
Engineering Services
HJR ENGINEERING
Electronics Design & Engineering Services
Contract hardware engineering from architecture and PCB design through prototyping, qualification, DFM and production handover.
Engineering services overview
Delivering electronics design and engineering support for high-reliability product development. Hardware capability spans architecture definition and schematic capture through PCB layout, electromechanical integration, design review, qualification, design-for-manufacture (DFM) and production handover.
Experience across harsh-environment industrial and subsea hardware informs a practical approach focused on robust, production-ready design, transparent technical communication and commercially sensible engineering decisions.
Selected Experience
Track Record Highlights
Harsh Environments
Hands-on design and qualification experience for critical subsea infrastructure assets targeting 3000m operating depth and a 25-year operational life.
High-Power Systems
Led control and instrumentation interfacing and enclosure engineering for industrial automated test equipment systems up to 11kVA.
Capabilities
Core Engineering Services
01
PCB Design & Hardware Architecture
- EDA & PCB Design: Altium Designer and KiCad for hierarchical schematic capture, component library creation, constraint management and multi-layer PCB layout.
- Industrial Communications: Hardware implementation and routing for Ethernet (RGMII), CAN bus, RS-485, RS-422 and RS-232 interfaces.
- Microcontroller Integration: Early-stage MCU selection and STM32CubeMX resource planning for embedded hardware.
- Fail-Safe Architecture: Fault-tolerant hardware strategies including redundant boot architectures and watchdog recovery logic.
- Signal Integrity: High-speed digital design review using Altium signal-integrity tools to assess impedance, routing and crosstalk risks.
- Power Management: Board-level power architecture including discrete buck converters, linear regulators and localised power distribution.
- Analogue & Control Interfaces: Practical analogue and sensor interfacing, including MCU-based control loops and firmware PID implementation.
02
Compliance, Qualification & Lab Support
- EMC/EMI Troubleshooting: Hands-on investigation and resolution of emissions and immunity issues during compliance preparation and formal testing.
- Harsh-Environment Testing: Environmental qualification support including thermal testing and profiling, hyperbaric pressure testing and vibration testing.
- Laboratory Diagnostics: Prototype bring-up, precision rework, soldering and debugging using standard electronic laboratory equipment.
- Test Automation: Python scripting for instrumentation control, hardware validation and accelerated test cycles.
- Rapid Prototyping: Breadboarding, functional mock-ups, custom enclosures and test components for early-stage system validation.
03
Manufacturing, Mechanical & Enclosure Integration
- Additive Manufacturing & 3D Printing: FreeCAD-based enclosure prototypes, assembly fixtures and laboratory jigs for rapid design iteration.
- Engineering Materials: Advanced filaments including high-temperature, fire-retardant and composite materials for functional test components and field-ready prototypes.
- Enclosure Coordination: Design, development and procurement of custom sheet-metal enclosures including 3U, 19-inch rack hardware.
- Vendor Liaison: Technical coordination with mechanical engineers, CNC suppliers and fabrication vendors from quotation through production.
- DFM & Production Handover: Gerbers, BOMs, assembly drawings, supplier quoting and direct resolution of PCB fabrication and assembly queries.
04
Design Review, Quality & Cost Optimisation
- Independent Peer Review: Schematic, PCB layout and product design reviews focused on signal performance, manufacturability and early risk reduction.
- Commercial Cost-Down: BOM reviews targeting lifecycle risk, supply-chain resilience and unit-cost reduction for new or existing assemblies.
- Standards & Quality Frameworks: Footprint creation, PCB layout and engineering documentation developed with reference to IPC standards and within ISO 9001 and API 17F quality frameworks.